PCB Assembly by FairyTek
FairyTek specializes in providing high-quality PCB assembly services to customers around the world, especially in emergency lighting industry. With a team of skilled professionals and state-of-the-art equipment, we are equipped to handle PCB assembly projects of all sizes and complexity.
Our PCB assembly services include everything from design and fabrication to component sourcing and assembly. We use advanced automated equipment to ensure precise and efficient assembly, and our team is trained to handle even the most complex projects with precision and attention to detail.
We understand that PCB assembly is a critical step in the overall success of a product, and we are committed to delivering top-quality PCBs that meet the highest standards. Our PCB assembly process is ISO 9001:2015 certified, ensuring that our customers can trust in the quality and reliability of our products.
In addition to our comprehensive PCB assembly services, we also offer a variety of other services to help our customers bring their circuit board designs to life. These services include:
- PCB design: Our team of experienced professionals can help you create a custom PCB design that meets your specific requirements and specifications.
- PCB fabrication: We use advanced equipment and processes to fabricate high-quality PCBs that are reliable and functional.
- Component sourcing: We have a network of trusted suppliers to help us acquire the components needed for your PCB assembly project.
- Testing and inspection: We conduct thorough testing and inspection to ensure that our PCBs meet the required standards and specifications.
- Packaging and shipping: We can handle the packaging and shipping of your finished PCBs to ensure that they arrive safely at their destination.
- Conformal coating: Conformal coating is a protective layer that can be applied to PCBs to protect them from environmental factors such as moisture, dust, and temperature fluctuations. We offer conformal coating services to help extend the lifespan and improve the reliability of your PCBs.
Our team is dedicated to providing exceptional service and support to our customers throughout the PCB assembly process. We are committed to helping you achieve success with your circuit board projects, and we are here to assist you every step of the way.
History PCBA Products
LED drive power PCBA
LED drive power PCBA
LED drive power PCBA
LED drive power PCBA
LED drive power PCBA
LED drive power PCBA
LED drive power PCBA
LED drive power PCBA
270W GAN charger circuit board
270W GAN charger circuit board
270W GAN charger circuit board
270W GAN charger circuit board
20W Adapter circuit board
270W GAN charger circuit board
Wireless charger circuit board
Wireless charger circuit board
270W GAN charger circuit board
Wireless charger circuit board
Step 1: Review of Design Files and Quote
FairyTek will review your design files to ensure that they are correct and complete, and will provide you with a quote for the assembly work. This ensure us a clear understanding of the customer's requirements and can provide an accurate landing of PCBA processing.
We will typically request the following design files from the customer
- Gerber files: Gerber files are a common format for PCB design files and contain information about the layout and placement of the PCB's components. FairyTek will need these files to accurately assemble the PCB.
- Bill of materials (BOM): A BOM is a list of all the components that are required for the PCB assembly, including their part numbers, quantities, and any additional information such as tolerances or manufacturer data. FairyTek will use the BOM to gather the necessary components for the assembly.
- Assembly drawings: Assembly drawings provide detailed instructions on how the PCB should be assembled, including the placement of each component and any additional notes or specifications. FairyTek will use these drawings to ensure that the PCB is assembled correctly.
- Test plans: Test plans outline the testing that will be performed on the completed PCB assemblies to ensure that they function correctly and meet the specified requirements. FairyTek will use these plans to guide the testing processes.
Step 2: Stencil Fabrication
Stencil fabrication is a process used in the PCB assembly process to apply a consistent and precise amount of solder paste to the PCB. The stencil is a thin sheet of metal or other material with openings the size and shape of the surface mount components on the PCB. The stencil is placed over the PCB and a thin layer of solder paste is applied over the stencil using a squeegee or other tool. The excess paste is then wiped away, leaving a thin layer of paste in the openings on the PCB.
Stencil fabrication is an important step in the PCB assembly process because it helps to ensure that the correct amount of solder paste is applied to the PCB, which is critical for creating reliable connections between the components and the PCB. The stencil also helps to ensure that the paste is applied consistently across the PCB, which is important for ensuring that all of the components are attached properly and that the PCB functions correctly.
Several factors can impact the quality of the stencil fabrication process in PCB assembly, including:
- Stencil thickness: The viscosity, or thickness, of the paste, can affect how easily it can be applied through the stencil openings.
- Stencil material: The material of the stencil impacts the durability and lifespan of the stencil, with some materials being more prone to wear or damage than others.
- Solder paste characteristics: The particle size and composition of the paste can also impact the accuracy of the paste application and the reliability of the connections between the components and the PCB.
- Accuracy of stencil openings: The accuracy of the stencil openings is also critical for ensuring a high-quality paste application.
Step 3: Dispensing Solder Paste
Applying solder paste to a PCB during the assembly process is an important step in ensuring that the surface mount components are properly attached to the PCB. Solder paste is a type of material used in the process of soldering, which is a method of joining two metal components together by melting and fusing a filler metal (solder) between them.
Solder paste is a mixture of fine solder particles, flux, and a paste-like binder. It is used to create a temporary mechanical bond between the components and the PCB, and to provide the heat required to melt the solder and create a permanent electrical connection.
The components are then placed onto the PCB, aligning them with the openings in the paste. The PCB is then heated in a reflow oven, which melts the solder paste and creates a permanent connection between the components and the PCB. The solder paste acts as a temporary mechanical bond to hold the components in place during the heating process, and also provides the heat needed to melt the solder and create a permanent electrical connection.
Step 4: Automated Component Placement
Automated component assembly is a crucial step in the production of printed circuit board assembly (PCBA). It involves the use of component pick and place machines to accurately and efficiently place electronic components onto a PCB, ensuring that they are properly aligned and soldered in place. A robotic arm is used to pick up individual components and place them onto the PCB in the correct location.
The component pick and place process typically begins with the creation of a component placement plan, which specifies the exact location and orientation of each component on the PCB. This plan is typically generated using computer-aided design (CAD) software and is based on the structure design of the PCB. Once the component placement plan has been created, the component pick and place machine or robot is used to locate and pick up each component from a supply tray or tape reel. The component is then placed onto the PCB in the correct location, using precise control and alignment to ensure that it is properly positioned. In some cases, the component may need to be rotated or flipped to achieve the correct orientation.
As a leading provider of PCBA services, FairyTek are committed to using the latest technologies and techniques in automated component assembly to ensure the highest quality and reliability of our products. Our state-of-the-art facilities and skilled technicians allow us to handle even the most complex and demanding projects with confidence and efficiency.
Step 5: Reflow Soldering
Reflow soldering is a process used in the manufacturing of printed circuit board assembly (PCBA) to create a strong, reliable connection between electronic components and a PCB. It involves heating the assembly to a high temperature in order to melt the solder, which is a filler metal that is used to join the components to the PCB.
Reflow soldering is a process for surface-mounted boards. Its process is relatively complex and can be divided into two types: single-sided mounting and double-sided mounting.
The reflow oven is a special heating chamber that is designed to heat the assembly to a high temperature, typically in the range of 220-260°C (428-500°F). The heat causes the solder paste to melt, forming a strong and reliable connection between the components and the PCB. The heating and cooling process is carefully controlled to ensure that the solder is melted and reflowed in a consistent and controlled manner.
Step 6: Quality Control and Inspection
Quality control and inspection are essential steps in the production of printed circuit board assembly (PCBA) to ensure that the finished products meet the required standards for performance, reliability, and safety. These processes involve the use of various testing and evaluation methods to identify and correct defects or deviations from specifications.
- Visual inspection: We exam the PCB and components with the naked eye or under magnification to identify any visible defects or issues, such as misaligned components, soldering defects, or damaged components.
- AOI (Automated Optical Inspection): We use specialized cameras and software to automatically inspect the PCB and components for defects or issues.
- ICT (In-Circuit Testing): We can use specialized equipment to test the electrical characteristics of the PCB and components while they are still in the circuit.
- Ultrasonic testing: Ultrasonic testing involves the use of high-frequency sound waves to inspect the PCBA for defects or issues that may not be visible using other inspection methods.
- X-ray inspection: We use X-ray technology to create an image of the inside of the PCBA, allowing defects or issues within the assembly to be identified.
In FairyTek, X-ray inspection is particularly useful in PCBA production for identifying issues:
- Soldering defects, including shorts, opens and bridging
- Misaligned or improperly positioned components
- Missing or broken components
- Internal damage or defects in components
Step 7: Placement and Soldering of Through-hole Components
The placement and soldering process typically begins by inserting the component manually leading through the holes in the PCB and aligning the component in the correct position. THT components are also known as Plated Through Holes, PTH, or DIP assembly. The component is then held in place using a jig or fixture, and the leads are soldered to the PCB using a soldering iron. The soldering process is carefully controlled to ensure that the solder forms a strong and reliable connection between the component and the PCB. Wave Soldering is a complex process that requires precise control of temperature and timing, as well as the use of specialized equipment and materials.
At FairyTek, ensuring proper placement and soldering of through-hole components is a key principle that our staff follows to ensure the proper functioning and reliability of the finished PCBA. We carefully control the temperature of the wave soldering process based on the characteristics of the components to ensure accurate and reliable results. This helps to ensure that the components are properly aligned and soldered in place, which is essential for the proper functioning of the final product.
Step 8: Functional testing
Functional testing is typically done after the PCBA has been completed after the wave soldering process. It involves testing individual components as well as the entire assembly and using a variety of techniques and methods depending on the specific requirements of the PCBA.
Some common techniques FairyTek used in functional testing include:
- Input/output testing: We test the PCBA's ability to accept input signals and provide output responses in accordance with the design specifications.
- Performance testing: We test the PCBA's performance under a variety of operating conditions to ensure that it meets the required specifications.
- Stress testing: We subject the PCBA to extreme operating conditions, such as high or low temperatures, to ensure that it is able to withstand the rigors of real-world use.
It is important to choose fixtures for functional testing that is capable of accurately and reliably holding and accessing the PCBA, and that can withstand the rigors of the testing process.
Some common types of fixtures FairyTek support in functional testing of PCBAs include:
- Test jigs: These are simple fixtures that are used to hold the PCBA in place and provide access to the components and connections for testing. Test jigs may be manually operated or automated, depending on the specific needs of the testing process.
- Socket fixtures: These are fixtures that have sockets that are designed to hold specific types of components, such as integrated circuits (ICs). Socket fixtures allow components to be easily swapped in and out for testing without the need to rework the PCBA.
- Probes: These are specialized fixtures that are used to make electrical connections to specific points on the PCBA for testing purposes. Probes may be manually operated or automated and may be used to test specific components or connections on the PCB.
FairyTek can help customers prepare testing fixtures to offer local tests before PCBAs are shipped, for the purpose of quality insurance of final goods.
Step 9: PCBA Board Final Cleaning
PCBA board final cleaning is a process used to remove any remaining contaminants or residues from the surface of a printed circuit board assembly (PCBA) after the production process is complete. This is typically done to improve the appearance of the PCBA and to ensure that it is free from any materials that could interfere with its performance or reliability.
FairyTek uses several different methods for PCBA board final cleaning, including:
- Solvent cleaning: This involves using a solvent, such as isopropyl alcohol, to dissolve and remove contaminants and residues from the PCBA surface.
- Aqueous cleaning: This involves using a water-based cleaning solution to remove contaminants and residues from the PCBA surface. Aqueous cleaning is typically less aggressive than solvent cleaning and is better suited for use with certain types of components.
- Mechanical cleaning: This involves using mechanical means, such as brushes or abrasive pads, to physically remove contaminants and residues from the PCBA surface.
The specific method of PCBA board final cleaning that is used will depend on the specific needs and requirements of the PCBA and the materials used in its production.
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